Food Engineering

PMMI, Rockwell Automation announce presenters and topics for PACK EXPO International

May 8, 2014
Educational sessions presented at the Center for Trends and Technology during PACK EXPO International 2014 will focus on efficiency and efficacy in production,according to its organizers.

The Center for Trends and Technology is being sponsored by Rockwell Automation and its PartnerNetwork Program.

PMMI, the Association for Packaging and Processing Technologies, and Rockwell announced the slate of presenters and topics to be discussed at the center earlier this week.

According to PMMI, subjects for the educational sessions include the Food Safety Modernization Act, machine safety, serialization, line integration and analytics, cloud computing and security.

“These sessions provide answers to questions that we at Rockwell Automation hear from our customers all the time,” said Mike Wagner, global packaging segment lead, Rockwell Automation. “They are very relevant across a broad base of manufacturers no matter the size and, really help in steering them to be as efficient in their plants as possible.”

Presentations will be from Cisco, Microsoft, Grantek Systems, Rockwell Automation, Interstate Control, Stone Technologies and the Alliance for Innovation and Operational Excellence (AIOE). 

PACK EXPO International 2014, owned and produced by PMMI, will take place in Chicago from Nov. 2 to Nov. 5 this year.