Food Engineering

Laser marking system

October 1, 2011


The Telesis EVC diode-pumped laser marking system can mark on-the-fly at high speeds without burn through on delicate foils and with contrast on various plastics; it also marks on chip boards, plastic bottles and other materials without consumables or ecology issues. It has a Q-switched Nd: YVO4 end-pumped laser design with a remote fiber-coupled diode pump source, and can operate in industrial environments where shock, vibration and dust are a concern. Features include a deep focal tolerance, high-quality small beam diameter, integrated PC with touch screen interface, Merlin LS AMI scan-and-go software, quick-posts and encoder controls.

Telesis Technologies Inc.; 724-733-0522; www.telesis.com