Food Engineering

PROCESS EXPO and PACK EXPO

October 1, 2008
The co-located shows and conferences provide a seamless interface between efficient, safe food processing and innovative packaging.



focus on change, innovation and sustainability

According to Mintel International, approximately 123,000 new food and beverage products were introduced in 2007, representing an increase of 16% over 2006. To get noticed in the crowd of new products, brand owners are looking for captivating and innovative packaging that will help their products grab the attention and wallets of potential customers. Processors are especially concerned with track and trace, plant optimization and food safety. PROCESS EXPO and PACK EXPO provide more than 2,000 co-located exhibits and 50 conference sessions at McCormick Place in Chicago with processing and packaging solutions.

Several international pavilions will feature suppliers from Brazil, China, France, Germany, Italy, Japan, Spain and the United Kingdom. In addition to the international exhibits, attendees will find the following pavilions:

• The Containers & Materials Pavilion

• The Showcase of Packaging Innovations

• The Radio Frequency Identification Pavilion

• The Brand Protection Pavilion and

• The Contract Packaging Pavilion.

PROCESS EXPO is sponsored by the Food Processing Suppliers Association (FPSA).  Its conference sessions run within PACK EXPO’s sessions and will be held on Tuesday and Wednesday mornings.

The processing track includes “In-Process Product Traceability: From Concept to Reality;” “Surface Pasteurization of Particulate Foods-Controlling Moisture and Quality;” “Pneumatic Conveying in the Food Industry: Options in Sanitary Design and Technology;” “Drying Technology: Heat Transfer, Energy Optimization, and Sanitation in Through-Circulation Drying Applications;” “Optimizing the Workforce: Can It Save the Plant?” and “Criteria for Designing Traceability Systems.” 

PACK EXPO International, organized by Packaging Machinery Manufacturers Institute (PMMI), includes The Showcase of Packaging Innovations will highlight more than 300 award-winning packaging designs from organizations such as the Flexible Packaging Association, Glass Packaging Institute, Paperboard Packaging Council and Institute of Packaging Professionals.

With its theme of “Change, Innovation and Sustainability,” the PMMI-sponsored packaging conference features a three-day program with sessions presented by industry leaders and innovators. Conference tracks include sustainability, brand protection, containers and materials, upgrading operations and converting.

Keynotes include “Keeping Score: How Wal-Mart and its Suppliers Continue to Advance Packaging Change, Innovation and Sustainability,” by Amy Zettlemoyer-Lazar, packaging director of Sam’s Club and co-manager of the Wal-mart Sustainability Value Network; “More Safety vs. Less Material? Where Does Packaging Go?” by Betsy Cohen, VP, sustainability, Nestlé; “Packaging Sustainability: From Board Room to Break Room,” by Trevor Cusworth, director, Deloitte Consulting LLP.; and “Packaging-Elemental to a Sustainable Future,” by Glenn Wright, commercial vice president, NA Basic Plastics, The Dow Chemical Company.  

The Show at a Glance

PROCESS EXPO 2008 and PACK EXPO International 2008

Where: McCormick Place, Chicago, IL

When: November 9 – 13

Exhibit Hours: Sunday, November 9 to Wednesday, November 12: 9:00 am to 5:00 pm; Thursday, November 13: 9:00 am to 2:00 pm.

Conference Sessions: Monday, November 10 to Wednesday, November 12

Contact: PROCESS EXPO at www.fpsa.org/processexpo/2008 or 703-761-2600

PACK EXPO at http://pei2008.packexpo.com or 886-229-3961