PACK EXPO and PROCESS EXPO Promise New Trends
October 1, 2006
If you thought tossing out Hershey bars and Reese's cups to all the little ghouls, ghosts and goblins in your neighborhood was the thing to do the last week in October, think again. PACK EXPO International and co-located PROCESS EXPO will be held October 29 through November 2 in Chicago's McCormick Place. The Packaging Machinery Manufacturer's Institute and the Food Processing Suppliers Association, respective sponsors of the events, promise a frighteningly good time.
The expected 50,000 attendees, including over 6,000 international visitors, can check out PACK EXPO exhibits that include the latest developments in packaging machinery, materials, packages and containers and components from over 1,600 exhibitors. PROCESS EXPO promises attendees access to 350 exhibitors who will demonstrate equipment for the fruit and vegetable, beverage, canning/freezing, environmental, instrumentation, prepared foods, can-making, meat, dairy and snack food industries.
If the exhibits alone aren't enough to get you there, the PACK EXPO pavilions might be the treat you're looking for.
An all-new Contract Packaging Pavilion will help visitors find guidelines for choosing the right contract packager for a job, discover opportunities for introducing new packaging technologies and concepts and explore strategies for using contract packaging to become more competitive.
Making its debut at PACK EXPO Las Vegas 2003, the Containers & Materials Pavilion was such a success that this year's attraction will be increased by a third.
A very timely Brand Protection Center will focus on packaging initiatives and technologies that protect against bioterrorism, package tampering, counterfeiting and product adulteration. From overt to covert and active to passive technologies, a full spectrum of product protection solutions offering a range of added safety measures can be explored.
Once again, the RFID Pavilion will highlight solutions that meet the requirements of the entire supply chain. Included in the exhibits will be technologies to upgrade conventional lines into RFID-enabled packaging lines.
The Showcase of Packaging Innovations will feature an array of the latest, award-winning packages from a selection of leading packaging organizations from around the world. While you're here, be sure to catch the first-ever PACK EXPO Selects, a program that identifies and displays creative commercial packages and containers designed, developed or executed by PACK EXPO exhibitors.
Another favorite PACK EXPO haunt-the Conference at PACK EXPO will include Packaging: A Change Agent in Change, Creating a Sustainable Future and The Wal-Mart/Sam's Club Packaging Vision.
PROCESS EXPO will feature the Packaging for Health & Safety seminar.
The Show at a GlancePACK EXPO International 2006 and PROCESS EXPO 2006
Where: McCormick Place, Chicago, IL
When: October 29 - November 2
Exhibit Hours: Sunday, October 29 to Wednesday, November 1: 9:00 am to 5:00 pm; Thursday, November 2: 9:00 am to 2:00 pm.
Fee: Advance Registration on or before Tuesday, October 10: $25; On-site registration or registration after October 10: $50
PACK EXPO Conference Sessions: Monday, October 30 to Wednesday, November 1
PACK EXPO Conference Fees: On or before Tuesday, October 10: $55 per session; After Tuesday, October 10: $75 per session.
PROCESS EXPO Seminar Sessions: Monday, October 30 to Wednesday, November 1
PROCESS EXPO Seminar Fees: $135 each workshop or $300 for all three.