PACK EXPO International will attract 48,000 professionals over three days to see the last innovations in processing and packaging technologies. Here’s a look at just a few of the equipment solutions exhibitors will introduce or highlight at the show.
PACK EXPO International 2026 will be held at McCormick Place in Chicago from October 18 to 21. The event will feature over 1.3 million square feet of exhibition space, accommodating 2,600 exhibitors and 48,000 attendees. Here’s a preview of some of the equipment solutions that exhibitors will introduce or showcase at the show.
Designed specifically for packaged applications, the X56 DXD+ delivers enhanced contamination detection capabilities where low-density contaminants, such as rubber and plastics, must be reliably detected.
Califia’s V31 vision inspection system is equipped with three cameras for identification and removal of high caps, damaged caps, broken shrink bands and other closure issues.
Designed to meet the demands of challenging applications in packaged products, the X52’s proprietary software seamlessly transitions between single energy, dual energy or both modes.
Mettler-Toledo's new M30 R-Series GC is an ideal entry-level metal detection solution for small and medium-size manufacturers and/or co-packers. The modular design of the fully integrated system can be adapted over time in line with evolving compliance and productivity needs.